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The back end of line (BEOL) is the second portion of IC fabrication where the individual devices get interconnected with wiring on the wafer, the metalization layer. Common metals are copper and aluminum. 
BEOL generally begins when the first layer of metal is deposited on the wafer. BEOL includes contacts, insulating layers (dielectrics), metal levels, and bonding sites for chip-to-package connections.

https://en.wikipedia.org/wiki/Back_end_of_line

Back End Of Line

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